l features l outline ? compact and lower height leds with lens. ? l size 1006 (0402) 1.00.6mm (t=0.2mm) l dimensions l recommended solder pattern l specifications typ. i f max. v r min.* 2 typ. max.* 2 i f min. typ. i f (v) (ma) ( m a) (v) (nm) (nm) (nm) (ma) (cd) (cd) (ma) CSL0701ut (619) 624 (629) 9 18 CSL0701dt (599) 605 (611) 20 35 * 1 : duty 1/10, 1khz 20 20 10 5 20 algainp 50 150* 1 red orange 120 power reverse current i r 2.1 5 - 40 to + 85 - 40 to + 100 operating temp. reverse storage temp. p d (mw) i f (ma) dissipation forward current v r (v) topr(oc) part no. CSL07 series available for both top-view and side view usages. emitting voltage current forward voltag v f peak forward color electrical and optical characteristics (ta=25oc) chip structure absolute maximum ratings (ta=25oc) i fp (ma) dominant wavelength l d luminous intensity i v tstg(oc) (unit : mm) tolerance : ? 0.2 (unit : mm) color type u d 2924 (1110) 2.9 2.4mm (t=3.1mm) 1/7 2015.03 - rev.b data sheet www.rohm.com ? 2015 rohm co., ltd. all rights reserved. 2 . 5 1 . 5 1 . 9 1 . 5
CSL07 series l electrical characteristics curves 0 10 20 30 40 50 60 -40 -20 0 20 40 60 80 100 CSL0701ut CSL0701dt r j - s 90oc/w r j - a 200oc/w tjmax 110oc 1 10 100 1.6 1.8 2.0 2.2 2.4 2.6 0.6 0.8 1.0 1.2 1.4 -40 -20 0 20 40 60 80 100 0.0 0.5 1.0 1.5 2.0 2.5 0 10 20 30 40 50 fig.1 forward current - forward voltage s forward current : i f [ma] forward voltage : v f [v] fig.2 luminous intensity - atmosphere temperature relative luminous intensity [a.u.] atmosphere temperature : ta [oc] fig.3 luminous intensity - forward current relative luminous intensity forward current : i f [ma] fig.4 derating maximum forward current : [ma] ambient temperature : ta [oc] CSL0701ut CSL0701dt ta=25 oc ta=25 oc i f = 20ma CSL0701ut CSL0701dt CSL0701ut CSL0701dt reference 2/7 2015.03 - rev.b www.rohm.com ? 2015 rohm co., ltd. all rights reserved. data sheet
CSL07 series l spectrum data * please take this data as a reference data for the samples are measured randomly. * the data is relativized for each color. it is not to show the spectrum peaks are equal. l viewing angle l rank reference of brightness red(u) orange(d) CSL0701ut CSL0701dt intensity [a.u.] wavelength [nm] scanning angle (deg) relative intensity 0 0.2 0.4 0.6 0.8 1 380 480 580 680 780 CSL0701ut CSL0701dt i f = 20ma (ta=25oc, i f =20ma) (ta=25oc, i f =20ma) reference 3/7 2015.03 - rev.b www.rohm.com ? 2015 rohm co., ltd. all rights reserved. data sheet to 50 iv (cd) to 10 to 20 to 30 to 40 CSL0701ut to 50 CSL0701dt iv (cd) to 10 to 20 to 30 to 40
CSL07 series l taping l part no. construction l packing specification rohm led products are being shipped with desiccant (silica gel) concluded in moisture-proof bags. pasting the moisture sensitive label on the outer surface of the moisture-proof bags or enclosing the humidity indication card inside the bag is available upon request.
please contact the nearest sales office or distributer if necessary. tolerance : ? 0.2mm (unit : mm) 4/7 2015.03 - rev.b www.rohm.com ? 2015 rohm co., ltd. all rights reserved. data sheet
5/7 1.storage if the product is heated during the reflow under the condition of hygroscopic state, it may vaporize and expand which will influence the performance of the product. therefore, the package is waterproof. please use the product following the conditions: ? using conditions classification temperature humidity expiration date remark 1 before using 5 to 30oc 30 to 70%rh within 1 year from receiving storage with waterproof package 2 after opening package 5 to 30oc below 70%rh within72h please storing in the airtight container with our desiccant (silica gel) ? baking bake the product in case of below: 1 the expiration date is passed. 2 the color of indicator (silica gel) turned from blue to colorless or from green to pink. (even if the product is within the expiration date.) ? baking conditions temperature time humidity 603oc 40 to 48h below 20%rh remark ? bake products in reel. ? reel and embossed tape are easy to be deformed when baking, so please try not to apply stress on it. ? recommend bake once. 2.application methods 2-1. precaution for drive system and off mode design the circuit without the electric load exceeding the absolute maximum rating that applies on the products. if drive by constant voltage, it may cause current deviation of the led and result in deviation of luminous intensity, so we recommend to drive by constant current. (deviation of vf value will cause deviation of current in led.) furthermore, for off mode, please do not apply voltage neither forward nor reverse. especially, for the products with the ag-paste used in the die bonding, theres high possibility to cause electro migration and result in function failure. 2-2. operation life span theres possibility for intensity of light drop according to working conditions and environments (applied current, surrounding temperature and humidity, corrosive gases), please call our sales staffs for inquiries about the concerned application below. 1 longtime intensity of light life 2 on mode all the time 2-3.applied stress on product the top of the led is very soft, which the silicon resin is used as sealing resin. therefore, please pay attention to the overstress on it which may influence its reliability. 2-4.usage the product is led. we are not responsible for the usage as the diode such as protection chip, rectifier, switching and so on. www.rohm.com ? 2015 rohm co., ltd. all rights reserved. data sheet CSL07 series 2015.03 - rev.b l precaution (surface mount device)
6/7 3. others 3-1. surrounding gas notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of the plating surface ) or optical characteristics changes (light intensity, chrominance) and change in quality of die bonding (ag-paste) materials. all of the above will cause function failure of the products. therefore, please pay attention to the storage environment for mounted product (concern the generated gas of the surrounding parts of the products and the atmospheric environment). 3-2. electrostatic damage tthe product is part of semiconductor and electrostatic sensitive, theres high possibility to be damaged by the electrostatic discharge. please take appropriate measures to avoid the static electricity from human body and earthing of production equipment. the resistance values of electrostatic discharge (actual values) vary with products, therefore, please call our sales staffs for inquiries. 3-3. electromagnetic wave please concern the influence on led in case of application with strong electromagnetic wave such as ih (induction heating). 4.mounting 4-1. soldering ?no resin hardening agent such as filler is used in the sealing resin of the product. therefore, resin expansion and moisture absorption at humidity will cause heat stress during soldering process and finally has bad influence on the products reliability. ?the product is not for flow soldering. ?do not expose the product in the environment of high temperature (over 100oc) or rapid temperature shift (within 3ocof temperature gradient) during the flow soldering of surrounding parts. ?please set appropriate reflow temperature based on our product usage conditions and specification. ?the max for reflowing is 2 times, please finish the second flow soldering and flow soldering with other parts within the usage limitation after open the moistureproof package. ?compare with n2 reflow, during air reflow, because of the heat and surrounding conditions, it may cause the discoloration of the resin. ?for our product that has no solder resist, because of its solder amount and soldering conditions, one of its specific characteristics is that solder will penetrate into led. thus, there's high possibility that will influence its reliability. therefore, please be informed, concerning it before using it. 4-2. automatic mounting 4-2-1.silicon resin sealing product the sealing resin of led is very soft, so please select adsorption nozzle that would not apply stress directly on the sealing section 4-2-2.mini package (smaller than 1608 size) vibration may result in low mounting rate since it will cause the static electricity of product and adhere to top cover tape. we recommend to ? set magnet on parts feeder cassette of the mounter to control the product stabilization ? set ionizer to prevent electrostatic charge 4-3. mounting location the stress like bending stress of circuit board dividing after mounting, may cause led package crack or damage of led internal junction, therefore, please concern the mounting direction and position to avoid bending or screwing with great stress of the circuit board. www.rohm.com ? 2015 rohm co., ltd. all rights reserved. data sheet CSL07 series 2015.03 - rev.b
1.9 1.5 1.5 2.5 7/7 4-5. soldering pattern for recommendation we recommend the soldering pattern that shows on the right. it will be different according to mounting situation of circuit board, therefore, please concern before designing. * * ? meaning of marks, conditions conditions 180oc 140oc 230 to 250oc 250oc(max) t /t under 3oc/sec. t /t over -3oc/sec. * 4-7. cleaning after soldering under 30oc within 3 minutes ultrasonic cleaning under 100oc within 3 minutes a>b>c>d the mechanical stress may damage the led after circuit mounting, so please pay attention to the touch on www.rohm.com ? 2015 rohm co., ltd. all rights reserved. data sheet CSL07 series 2015.03 - rev.b
r1 102 a www .rohm.com ? 2015 rohm co., ltd. all rights reserved. notice rohm c u stomer support sys tem h ttp://w w w . r ohm .com/con tact/ thank you for your accessing to rohm pr oduct informations. mor e detail pr oduct informations and catalogs ar e available, please contact us. notes the inf or mation contained herein is subject to change without notic e . bef ore y ou use our p r o d u c t s , ple a s e c o n t a c t o u r s a l e s r e p r e s e n t a t i v e and v e r i f y the l a test specifica- tions : althoug h r o h m is c o n t i n uousl y w o r king t o impro ve p roduct r elia bility and quality , semicon- duc tors c an brea k do w n and mal f unction due to va r ious f actor s . the ref o r e , i n ord e r to p r e ve n t per sonal i n jur y or fire a r isin g f rom f a ilure , please tak e saf ety meas ure s suc h a s c o m plying wit h the der ating cha r a cte r istics , imple menting redundant and f ire p r e ve nti o n d e s i g n s , and u tilizing bac k ups a nd f ail- saf e p rocedures . r o hm shall h a ve no responsibility f or an y damages ar ising out of the use of our p oducts beyond the r ating specified b y r ohm. examples of application circuits , circuit constants and an y other inf or mation contained herein are pro vided only to illustr ate the standard usage and oper ations of the products . the per iphe r al conditions m ust be tak en into account when designing circuits f or mass production. the technical inf or mation specified herein is intended only to sho w the typical functions of and e xamples of application circuits f or the products . r ohm does not grant y ou, e xplicitly or implicitl y , an y license to use or e x ercise intellectual prope r ty or other r ights held b y r ohm or an y other par ties . r ohm shall ha v e no responsibility whatsoe v er f or an y dispute ar ising out of the use of such technical in f or mation. the products are intended f or use in gene r al electronic equipment (i.e . a v/o a de vices , comm uni- cation, consumer systems , gaming/ente r tainment sets) as w ell as the applications indicated in this document. the products specified in this document are not designed to be r adiation tole r ant. f or use of our products in applications requi r ing a high deg ree of reliability (as exemplified bel o w), please contact and consult with a r ohm representati v e : tr anspo r tation equipment (i.e . cars , ships , tr ains), pr imar y comm unication equipment, tr affic lights , fire/cr ime pre v ention, saf ety equipment, medical system s , ser v ers , solar cells , and po w er tr ansmission system s . do not use our products in applications requir ing e xtremely high reliabilit y , such as aerospace equipment, n uclear p o w er control systems , and submar ine repeater s . r ohm shall ha v e no responsibility f or an y damages or inju r y ar ising from non-compliance with the recommended usage conditions and specifications contained herein. r ohm has used reasona b le care to ensur the accur acy of the inf or mation contained in this document . ho w e v er , r ohm does not w arr ants that such inf or mation is error-free , and r ohm shall ha v e no responsibility f or an y damages ar ising from an y inaccu r acy or mispr int of such inf or mation. please use the products in accordance with an y applica b le en vironmental la ws and regulation s , such as the rohs directiv e . f or more details , including rohs compatibilit y , please contact a r ohm sales office . r ohm shall ha v e no responsibility f or an y damages or losses resulting non-compliance with a n y applica b le la ws or regulation s . when pro viding our products and technologies contained in this document to other countr ies , y ou m ust abide b y the procedures and pro visions stipulated in all applica b le e xpor t la ws and regulation s , including without limitation the us expor t administr ation regulations and the f oreign exchange and f oreign t r ade act. this document, in par t or in whol e , ma y not be repr inted or reproduced without pr ior consent of r ohm. 1) 2) 3) 4) 5) 6) 7) 8) 9) 10) 11) 12) 13) 14)
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